Assembler - 2nd Shift

MACOM designs and manufactures semiconductor products for DataCenter, Telecommunication and Industrial and Defense applications.Headquartered in Lowell, Massachusetts, MACOM has design centers and salesoffices throughout North America, Europe and Asia. MACOM is certified to theISO9001 international quality standard and ISO14001 environmental managementstandard.

MACOM has more than 65 years of application expertise withmultiple design centers, Si, GaAs and InP fabrication, manufacturing, assemblyand test, and operational facilities throughout North America, Europe, andAsia. Click here to view our facilities. In addition, MACOM offers foundryservices that represents a key core competency within our business.

MACOM sells and distributes products globally via a saleschannel comprised of a direct field sales force, authorized salesrepresentatives and leading industry distributors. Our sales team is trainedacross all of our products to give our customers insights into our entireportfolio.

This role will be an assembly operator working with various SMT, DieAttach or Wire Bonding equipment.

• Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
• Operate and set-up manual Gold wire bonders, manual eutectic/epoxy die attach systems or SMT equipment per documented work instructions.
• Involves working to microcircuit layout drawings; Operator is responsible for proper wire formation, bond appearance and bond strength per Mil Std 883.
• Operator is responsible for proper die attachment, including coverage and die shear strength per Mil Std 883.
• Operator is responsible for proper soldering of components - both manual and automatic per IPC-610 standards.
• Flexibility to be trained in multiple Microelectronics processes that involve other assembly activities.
• Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.

• Ability to set-up, operate and adjust or ability to learn to run a variety of microelectronic production equipment.
• Minimum of 2 years' experience in microelectronics module assembly area.
• High School diploma required.
• Wire-bonding gold wire or ribbon to a variety of die and substrates.
• Die attach using solder preforms or epoxy to a variety of components.
• SMT using Mydata pick and place equipment.
• Operate following all area ESD protocols.
• Physical Environment and Working Conditions: Clean-room environment withsmocks, masks and gloves.

Due to ITAR regulations, candidates must be a US Person.

MACOM is an Equal Opportunity Employer committed to a diverseworkforce. MACOM will not discriminateagainst any worker or job applicant on the basis of race, color, religion, sex,gender identity, sexual orientation, national origin, age, disability, geneticinformation, veteran status, military service, marital status, or any othercategory protected under applicable law.

MACOM is committed to working with and providing reasonableaccommodations to qualified individuals with physical and mentaldisabilities. If you have a disability and are in need of a reasonableaccommodation with respect to any part of the application process please call+~~~ or email ~~~. Provide your name, phonenumber and the position title and location in which you are interested, andnature of accommodation needed, and we will get back to you. We also workwith current employees who request or need reasonable accommodation in order toperform the essential functions of their jobs.